Description
General information | |
Type | CPU / Microprocessor |
Market segment | Desktop |
Family | VIA C3 Samuel |
CPU part number |
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Frequency ? | 700 MHz |
Bus speed ? | 100 MHz |
Clock multiplier ? | 7 |
Package | 370-pin ceramic PGA 1.95″ x 1.95″ (4.95 cm x 4.95 cm) |
Socket | Socket 370 / PGA370 |
Architecture / Microarchitecture | |
Instruction set | x86 |
Processor core ? | Samuel |
Manufacturing process | 0.18 micron CMOS technology |
Die | 75mm2 |
Data width | 32 bit |
Floating Point Unit | Integrated |
Level 1 cache size ? | 64 KB 4-way set associative instruction cache 64 KB 4-way set associative data cache |
Pipeline | 12 stages |
Extensions & Technologies |
|
Low power features | |
Electrical / Thermal parameters | |
V core ? | 1.9V 2V |
Minimum/Maximum operating temperature ? | 0°C – 70°C |
Typical/Maximum power dissipation |
9.2 Watt / 15.3 Watt (1.9 Volt) |